Powder finishing mortar and adhesive made of cement, selected mineral aggregates, additives.
For bonding and rendering polystyrene insulation panels. Component of the Ekomix EPS system.
APPLICATION AREAS
Ekomix is suitable for:
- Bonding and skimming polystyrene insulation panels
- Product with requirements in accordance with ETAG 004.
INSTRUCTIONS FOR USE
Preparation for use
The substrate must be dry, not frozen, free of dust, efflorescence, not water-repellent and solid. The wall flatness
must be within the tolerances prescribed by ÖNORM DIN 18202.
Product preparation
Mix Ekomix with appr ox. 6.00-6.25 litres of clean water per 25 kg bag (0.24-0.25 litres of water per 1 kg powder) in
a clean container and stir constantly using a low speed mortar mixer (max. 500 rpm) until the mixture is
homogeneous and then leave to stand for approx. 5 minutes. Mix again and, if necessary, correct the consistency
with a small amount of water. Do not add other substances to the product.
Instructions for use
For bonding insulatio n panels: apply the adhesive using the dot and stripe method (bonding surface approx. 40
%). Strip width approx. 4 cm, height approx. 2 cm.
Rendering of insulation panels: apply the render a pprox. 2-3 days after bonding (depending on the weather
conditions and any additional dowelling) in a minimum thickness of 3 mm and then spread with a toothed trowel.
Bury the T50 reinforcement mesh in the render bed; at the joints overlap by at least 10 cm and cover it completely
with the trowel. When the render is completely dry (maximum 7 days depending on the weather conditions), the
suitable Torggler EKOR wall coating can be applied.
The mixture workability time is about 2 hours. Mater ial left in open containers should no longer be used or mixed
with fresh material.
During the processin g and drying step, the temperature of the surrounding environment and the substrate must
not fall below +5 °C. Protect against frost, too fast drying (direct beating sun, wind) and subsequent humidity
(rain) until completely dry.
